IEC 60317-36-2013 pdf Specifications for particular types of winding wires – Part 36: Solderable polyesterimide enamelled round copper wire, class 180, with a bonding layer

18 Heat or solvent bonding 18.1 Heat bonding 18.1.1 Heat bonding strength of a helical coil 18.1.1.1 At room temperature The specimens shall be prepared according to the test method, and the temperature of the oven for bonding shall be fixed as agreed between purchaser and supplier for the different types of bonding enamels. The suggested temperature for polyamide bonding enamel is (200 ± 2) °C and the suggested temperature for aromatic polyamide bonding enamel is (230 ± 2) °C. Results: when testing the specimens according to the test method, under the action of load specified in Table 2, no turns (other than possibly the first and the last) shall separate. 18.1 .1.2 At elevated temperature The specimens shall be prepared and shall be conditioned as described in the test method. The elevated temperature shall be fixed as agreed between purchaser and supplier for the different types of bonding enamels. The suggested temperature for polyamide bonding enamel is (1 55 ± 2) °C and the suggested temperature for aromatic polyamide bonding enamel is (1 70 ± 2) °C. Results: when testing the specimens according to the test method, under the action of load specified in Table 2, no turns (other than possibly the first and the last) shall separate.
18.1.2 Bond strength on a twisted coil 18.1.2.1 General This test shall be considered only as a special test and is applicable to the diameter 0,31 5 mm. 18.1.2.2 At room temperature When preparing a test sample of diameter 0,31 5 mm according to the test method, the time shall be 30 s and the current shall be fixed as agreed between purchaser and supplier. The suggested value for polyamide bonding enamel is (2,7 ± 0,1 ) A and the suggested value for aromatic polyamide bonding enamel is (3,0 ± 0,1 ) A. Results: when testing the samples according to the test method, under the action of the deflection force of 1 00 N, the sample shall not break. 18.1.2.3 At elevated temperature The samples of diameter 0,31 5 mm shall be prepared according to the test method, using the parameters listed in 1 8.1 .2.2 and shall then be conditioned as described in the test method. The elevated temperature shall be fixed as agreed between purchaser and supplier. The suggested temperature for polyamide bonding enamel is (1 55 ± 2) °C and the suggested temperature for aromatic polyamide bonding enamel is (1 70 ± 2) °C.