DD IEC PAS 62588-2008 pdf Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes 

3.4 2nd Level Interconnect Component Label A label placed on boxes and bags that contain components with either Pb-containing or Pb-free terminal materials/finishes. The label includes the material category and maximum component temperature (see 3.12 and 3.13). See Figure 4- for label formats for components with Pb-containing finishes/materials and Figures 4-4 and 4-5 for components with Pb-free finishes/materials. 3.52nd Level Interconnect Terminal Finish or Material The material at the component 2nd level termination referred to in Figure 3-1. Depending on the component type this material could refer to the terminal finish or ball material. 3.6 Component An individual part such as a connector, capacitor, integrated circuit, socket, multichip module, and hybrid circuits, etc. 3.7 Base Materials Base materials are the laminates and/or the prepregs used to fabricate the PCB. 3.8 Halogen-Free Board Printed board resins plus rein- forcement matrix that contain maximum total halogens ol 1500 ppm, with less than 900 ppm bromine and less than 900 ppm chlorine (per IEC 61249-2-21). 3.9 Homogeneous Material A material of uniform com- position throughout that cannot be mechanically disjointed into different materials. Mechanically disjointed means that the materials can, in principle, be separated by mechanical actions such as: unscrewing, cutting, crushing, grinding, and abrasive processes.
5 MARKING/L ABELING CATEGORIES These categories are for the technical purposes of this docu- ment and are not to be used for determining regulatory compliance. 5.1 PCB Base Material Categories The PCB base mate- rials may be identified by using the classfication system found in IPC-4101, where a unique Specification Sheet (“slash-sheet”) number identifies a specific grade of mate- rial. Some of the common base materials expected to be used on PCBs are shown here. However, other grades of base materials are possible. These base materials have an epoxy resin system with woven-glass reinforcement, plus distinguishing properties. a) /92: Phosphorous flame retardant; Tg 110 to 150°C b) /95: Aluminum Hydroxide flame retardant; Tg 150 to 200°C c) /99: Bromine flame retardant; contains inorganic fll- ers; Tg 150°C min. d) /126: Bromine flame retardant; contains inorganic fll- ers; Tg 170°C min. For PCBs made with more than one grade of materials, mark or label the slash-sheet of the material with the low- est temperature rating.